LOCTITE ABLESTIK 285 adhesive is designed for assembly applications that require thermal management.
It is also recommended for low stress bonding applications.
Bonding metals and ceramic substrates in heat sink applications.
Features :
- Technology : Epoxy
- Appearance (Resin) : Black
- Thermally conductive
- Conductivity : 1,44 W/m.K
- Good chemical resistance
- Good physical strength
With Catalyst 9
- Mix ratio by volume (Resin:Hardener) : 100:8,5
- Mix ratio by weight (Resin:Hardener) : 100:3,5
- Temperature : -40 °C / +130 °C
With Catalyst 11
- Mix ratio by volume (Resin:Hardener) : 100:9,9
- Mix ratio by weight (Resin:Hardener) : 100:4
- Temperature : -55 °C / +155 °C
With Catalyst 23 LV
- Mix ratio by volume (Resin:Hardener) : 100:17
- Mix ratio by weight (Resin:Hardener) : 100:7,3
- Temperature : -65 °C / +105 °C
Connexion
