Modified, solvent free epoxy resin with inorganic filler.
Optimally filled casting and impregnating systems for processing and curing at room temperature or slightly higher temperatures.
Features :
- Hardness : 88 Shore D
- Thermal class : B
- Tensile strength : 45 MPa
- Elongation at break : 1,45 %
- Thermal conductivity : 0,67 W/mK
- Dielectric strength : 28 kV/mm
- UL94 V-0
Mix ratio ( CW 2250-1 / HY 2251 ) :
- by weight : 100 / 13
- by volume : 100 / 20
Applications :
Small transformers, filters, capacitors, coils, electronic circuits.
Connexion
