CHO-BOND 1029 is a silver plated copper filled, two-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved.
CHO-BOND 1029 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates.
Primer 1085 included.
Features :
- Filler : Silver - Plated copper
- Color : Brownish red
- Hardness : 80 Shore A
- Temperature : -55 °C / +125 °C
- Maximum thickness recommended : 0,20 mm
- Two component
- Fast heat cure, increases throughput, minimizes equipment downtime
- Silver plated copper filler
- Good conductivity 0.060 ohm-cm
- Low VOCs
- Minimal shrinkage
Connexion
