SMA is a heat curable, one-part thixotropic adhesive. It has high uncured green strength and a fast cure cycle with medium bond strength.
It is used for holding components in place during soldering operations in surface mount assemblies.
Properties :
- High 'green strength'; ensures components do not move during handling and before curing
- Single-part system with thixotropic properties; high dot profile
- Long term stability after cure cycle; flexible in cured state to ensure components are not stressed
- Fast cure heat cure or at 90°C for component safety; not affected by UV light during assembly
Characteristics :
- Color : Red
- Hardness : 85 Shore D
- Temperature : -40 °C / +130 °C
Connexion
