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HEAT SINK COMPOUND IN 20 GR SYRINGE

(Code: 97-10303-01)

Data Sheet
7.29 €
(Sold in packs of 24)
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HEAT SINK COMPOUND IN 20 GR SYRINGE
Compound to increase the thermal conductivity and the efficient heat dissipation at electronic components.

Features :
- Appearance : Paste
- Colour : White
- High thermal conductivity.
- Excellent moisture buffer.
- Low metallic impurity content.

Applications :
- Printed circuit boards.
- Electronic components.
- Control assemblies.