General Features :
- Technology : Epoxy
- Colour : Black
STYCAST 1090/Catalyst 9 is designed for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications.
STYCAST 1090/Catalyst 9 passes NASA outgassing standards.
Features with Catalyst 9 :
- Hardness : 80 Shore D
- Temperature : -40 °C / +130 °C
- Mix ratio by weight ( Resin / Catalyst ) : 100 / 9
- Mix ratio by volume ( Resin / Catalyst ) : 100 / 7
- Thermal conductivity : 0,19 W/m.K
- Tensile strength : 3 000 psi
- Compressive strength : 12 000 psi
STYCAST 1090/Catalyst 11 is designed for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications.
STYCAST 1090/Catalyst 11 passes NASA outgassing standards.
Features with Catalyst 11 :
- Hardness : 82 Shore D
- Temperature : -55 °C / +155 °C
- Mix ratio by weight ( Resin / Catalyst ) : 100 / 10,5
- Mix ratio by volume ( Resin / Catalyst ) : 100 / 7,5
- Thermal conductivity : 0,19 W/m.K
- Tensile strength : 4 700 psi
- Compressive strength : 12 000 psi
STYCAST 1090/Catalyst 23LV is designed for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications.
Features with Catalyst 23 LV :
- Hardness : 75 Shore D
- Temperature : -65 °C / +105 °C
- Mix ratio by weight ( Resin / Catalyst ) : 100 / 18,5
- Mix ratio by volume ( Resin / Catalyst ) : 100 / 14,5
- Thermal conductivity : 0,19 W/m.K
- Tensile strength : 3 900 psi
- Compressive strength : 8 900 psi
Connexion
