LOCTITE STYCAST 1090 SI - CAN 500 GR
General Features :
- Technology : Epoxy
- Colour : Black
STYCAST 1090SI/Catalyst 9 encapsulant is recommended for applications where high compressive stress is applied to encapsulated circuitry - as in deep ocean work.
This product will have a minimum effect on electronic circuit operation and shows negligible deformation and water absorption.
Features with Catalyst 9 :
- Hardness : > 75 Shore D
- Temperature : -70 °C / +125 °C
- Mix ratio by weight ( Resin / Catalyst ) : 100 / 11
- Thermal conductivity : 0,13 - 0,18 W/m.K
- Tensile strength : 20 N/mm²
- Compressive strength : 65 N/mm²
STYCAST1090SI/Catalyst 11 is designed for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications.
It is completely unicellular so moisture absorption is negligible.
Features with Catalyst 11 :
- Hardness : 80 Shore D
- Temperature : -55 °C / +155 °C
- Mix ratio by weight ( Resin / Catalyst ) : 100 / 8
- Thermal conductivity : 0,17 W/m.K
- Tensile strength : 37 N/mm²
- Compressive strength : 83 N/mm²
STYCAST 1090SI / Catalyst 23LV is designed for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications.
It is completely unicellular so moisture absorption is negligible.
Features with Catalyst 23 LV :
- Hardness : 78 Shore D
- Temperature : -65 °C / +105 °C
- Mix ratio by weight ( Resin / Catalyst ) : 100 / 23
- Mix ratio by volume ( Resin / Catalyst ) : 100 / 15,5
- Thermal conductivity : 0,17 W/m.K
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