TECKBOND-C is a silicone rubber base filled with silver-plated copper particles to produce a highly conductive one-component adhesive sealant.
The system is an RTV moisture-cured compound which is ready to use without additional preparation or mixing.
The compound cures at room temperature to form a flexible resilient conductive bond or sealant.
Features :
- Number of Components: One + primer
- Resin: Silicone
- Filler: Ag/Cu
- Color : Gray
- Temperature : -65 °C / +182 °C
Applications :
TECKBOND conductive adhesive-sealants are recommended wherever a flexible bond is required in a metal-to-silicone gasket application.
These adhesives are recommended in applications where the bond thickness is less than 0.016 in. [0.4 mm].
To ensure optimum bond performance, the surface of the metal may require priming.
Connexion
