Teroson MS 500 is a hot applicable, at room temperature, highly viscous and sag-resistant one-component adhesive based on silane modified polymers which cures by reaction with moisture to an elastic product.
Characteristics
- At application temperature Teroson MS 500 has a low viscosity and is easy to apply
- During cooling a high position tack (high holding force, green strength) occurs
- The high position tack depends on the application temperature
- The higher the application temperature (up to 120° C) the stronger the high position tack
- Free of solvents, isocyanates, silicones and PVC
- Good adhesion to many substrates
- Compatible with suitable paint systems
- Good UV resistance
Application
- Teroson MS 500 is used for elastic bonding on metallic or painted substrates as well as for adhesive sealings of all kind
- Teroson MS 500 can be used to shorten the handling time and therefore to increase the productivity in industrial processes (e.g. for framing or assembly of photovoltaic modules)
Technical characteristics
- Colour : white
- Odour : characteristic
- Consistancy : paste, high holding force
- Density : approx. 1,45 g/cm³
- Sag resistance : no sagging (DIN profile 15 mm)
- Skin formation time : approx. 10 to 15 min*
- Cure rate : approx. 3 mm/24 h*
- Shore-A-hardness (ISO 868, Durometer A): approx. 63
- Tensile strength (ISO 37) : approx. 3 MPa
- Elongation at break (ISO 37, speed 200 mm/min) : approx. 200%
- Stress at 100 % elongation (acc. to ISO 37) : 2,0 MPa
- Volume change ( DIN 52451) : < 2%
- Tensile shear strength (ISO 4587) : approx. 2,5 MPa*
- Substrates : Al 99.5
- Layer thickness : 2 mm
- Cross head speed : 50 mm/min
- UV resistance : no signif. changes
- UV source: Osram Vitalux 300W
- Distance to the specimen : 25 cm
- Test period : 6 weeks
- Damp heat test durability : Reference IEC 61215/61646 clause 10.13 : given**
- Test period : 1000 h
- Application temperature : +60°C to +120°C
- In service temperature range : -40°C to +100°C
- Short exposure (30 min) : +120°C***
* ISO 291 standard climate : 23°C, 50% relative air humidity
**Damp heat conditions: 85°C, 85% relative air humidity
***in a bonding after complete curing
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